PC-AutoBond Epoxy

PC-Auto Bond™ is fast curing, strong and flexible cold weld Epoxy formulation. Product can be applied using a mixing nozzle or mixing stick. PC-Auto Bond™ is an extremely flexible epoxy with exceptional tensile adhesion and peel strength to a wide variety of substrates. In just a few minutes PC-Auto Bond™ forms a tough bond without the need for clamping and exhibits superior shatter, impact and vibration stability and resistance. Added flexibility creates high strength, permanent bond. Directions: Prep surfaces by roughing up and making sure surface is clean and free of dirt, oil, rust, etc. Do not subject cured epoxy to heat over 300o F. Remove cap from end syringe (twist). Depress plunger evenly to dispense equal amounts of resin and hardener. MIX THOROUGHLY ON A FLAT SURFACE. Or attach mixing nozzle and depress plunger to mix product. Replace cap. ***Note: Use Nozzle or Hand Mix: If using nozzle for application, once finished, remove nozzle and replace cap on the end of syringe. Store for future use. Application Limitations - Maximum temperature range: 250°F (121°C) continuous 300°F (149°C) intermittent.